Lead Free Solder,Lead Solder,Aluminum Welding Solder

Sn Ag Solder Gold-tin solder alloys have high strength, good oxidation resistance , excellent resistance to thermal fatigue and creep resistance , low melting point , good fluidity characteristics, making it the best solder optoelectronic package. Excellent performance, high reliability , no pollution, has gradually been more and more people understand and apply .

Sn97Ag3 Solder mainly for the required strength of the connection, however small joints, such as electronic equipment, instruments, household appliances electronic circuit connector.

Sn96.5Ag3.5 Solder Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored welding of electronic components, such as widely used in the computer , radios, televisions, appliances, instruments, etc.

Sn96.3Ag3.7 Solder Solder widely properties, high tensile strength, excellent fatigue resistance, special heat conductivity, corrosion resistance strong, powerful antioxidant. Solidus and liquidus is221 ℃. High strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package.

Medium temperature Solder Alloy Medium temp lead-free solder refers to filler metals which are of medium melting points. It belongs to soft solder alloy which is opposed to the high-melting-point hard solder alloy. This solder is perfect for manual soldering, component installation as well as solder-joint repairing.

Sn In Ag Bi Alloy Solder Different types of solder is different additives, additives to improve the solder in the soldering part of the auxiliary heat conduction process, removal of the oxide, reduces the surface tension of the material to be welded, the welding material of surface oil is removed, increase the welding area. Tin solder alloy wire characteristics with a certain length and diameter, can be used in conjunction with the electric iron soldering of electronic devices.

Low Mid temperature Alloy Solder Lead-free solders generally available manufacturing method of the casting, i.e., said heavy metal raw materials, and heated and stirred in air melt in a crucible or pot. Solder alloy prepared by the method of the invention, its advantages First, reduce the melting point of the solder alloy, generally less than 200 ℃; Second, the solid-liquid phase difference between the alloy up the following 2 ℃, avoid isolated spot defects; Third alloy homogeneous, the alloy strength increases; Fourth spreading rate of the solder alloy can

Sn89ZnBi3 Solder A low temperature solder of bismuth, indium, cadmium in the formation of solder in the solder alloy, mainly for microelectronic sensor assembly of parts with low heat resistance, good wettability and solderability, solder full, uniform welding excellent results, without requiring high temperatures and pressures may be used to seal solder metal welding.

Sn91Zn9 Alloy Solder Low temperature solder solder bar, a low temperature solder of bismuth, indium, cadmium in the formation of solder in the solder alloy, mainly for microelectronic sensor assembly of parts with low heat resistance, good oxidation resistance, flowability high welding resistance, excellent wettability and solderability, solder full, uniform, welding with excellent results.

Low Temperature Alloy Solder Gold-tin solder alloys have high strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package. With the rapid development of optoelectronic devices, the demand for gold-tin solder alloy is also growing. Gold-tin solder alloy with excellent performance, high reliability, no pollution, has gradually been more and more people understand and apply.