Sn97Ag3 Solder
Introduction
As one of the lead free Sn-Ag alloy solders, Sn97Ag3 solder is also widely used because of good wettability, fast soldering speed, bright and smooth solder point surface, good fluidity and high thermal fatigue resistance. Its solidus is221 ℃, and liquidus is222℃.
Roles of Each Element
1. Silver provides mechanical strength, but it has weaker ductility than lead. In lead free Sn-Ag alloy solders, silver improves resistance to fatigue from thermal cycles.
2. Copper lowers the melting point, improves resistance to thermal cycle fatigue, and improves wetting properties of the molten solder. It also slows down the rate of dissolution of copper.
Parameters of Lead Free Sn-Ag Alloy Solders
|
Alloy Composition |
Melting Point (℃) |
Specific Gravity |
Application |
|
|
Solidus |
Liquidus |
|||
|
Sn-3Ag |
221 |
222 |
7.40 |
Hand Soldering and Wave Soldering |
- Sn96.5Ag3.5 Solder Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored welding of electronic components, such as widely used in the computer , radios, televisions, appliances, instruments, etc.
- Sn96.3Ag3.7 Solder Solder widely properties, high tensile strength, excellent fatigue resistance, special heat conductivity, corrosion resistance strong, powerful antioxidant. Solidus and liquidus is221 ℃. High strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package.