Medium High Temperature Alloy Solder
- Sn Ag Cu Solder The biggest advantage is its copper solder easily reduced oxides of copper, nickel and other metals have good wettability, in vacuum or protective atmosphere brazing carbon steel, low alloy steel, stainless steel, nickel, copper-nickel alloy , tungsten and molybdenum. In a reducing atmosphere brazing, the brazing material should be used, or oxygen-free copper deoxidized copper brazing.
- Sn96.5Ag3Cu0.5 Solder Wire and Solder Bar Applied to a variety of electronic components welding in televisions, computers, polychlorinated biphenyls (PCBS), led, instruments, meters, etc.It can be manual welding and wave soldering。
- Sn95.8Ag3.5Cu0.7 Solder Solder is a general term applied to fill the weld seam welding and brazing layers of metal alloy materials. Including welding (welding wire), welding (welding rod), solder (brazing and soldering alloy) and so on. Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored wire and so on.
- Sn95.5Ag4Cu0.5 Solder Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored wire and so on. High strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package.
- Sn95.5Ag3.8Cu0.7 Solder The main requirements for connecting high strength metal components, such as small and soft solder solder (tin-lead based alloy) welded joint strength, but is mainly used to connect small joints of the strength requirements, such as electronic equipment, instruments , home appliances electronic circuit connector.
- Sn Ag Solder Gold-tin solder alloys have high strength, good oxidation resistance , excellent resistance to thermal fatigue and creep resistance , low melting point , good fluidity characteristics, making it the best solder optoelectronic package. Excellent performance, high reliability , no pollution, has gradually been more and more people understand and apply .
- Sn97Ag3 Solder mainly for the required strength of the connection, however small joints, such as electronic equipment, instruments, household appliances electronic circuit connector.
- Sn96.5Ag3.5 Solder Welding solder is usually not lower than the melting temperature of the solidus of the base material, its chemical composition, mechanical, and thermal properties are relatively close to the base material, such as a variety of welding, flux-cored welding of electronic components, such as widely used in the computer , radios, televisions, appliances, instruments, etc.
- Sn96.3Ag3.7 Solder Solder widely properties, high tensile strength, excellent fatigue resistance, special heat conductivity, corrosion resistance strong, powerful antioxidant. Solidus and liquidus is221 ℃. High strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package.
Introduction
With increasing demands for environmental protection, the lead free alloy solder gradually replace the traditional lead solders. Our medium temperature solders are widely used in soldering electronic components in computers, radios, instruments, meters, cooper plates, PCBs and many other metal types of equipments. They have lower melting points (90 °Cto450°C) than solders which we introduced before in the high medium solders. According to compositions, they can also be divided into several categories, including Sn-Ag-Cu solders, Sn-Ag solders, Sn-Bi solders, etc.
Features of Lead Free Alloy Solder
1. This solder has the lead content less than 100 ppm.
2. It is characterized by favorable wetting property, fast soldering speed, outstanding anti-oxidant property, good fluidity, great thermal fatigue resistance and high tensile strength.
3. During soldering, the tin rarely splatter around; besides, the solder joints are with bright and smooth surface.
4. We offer medium temperature solders in various forms, such as wires and bars.
5. 2% rosin flux is contained in the solder.
6. The lead free alloy solder wires/bars need not be cleaned.
7. Solder residue is easy to remove by hot air after soldering work if necessary.
8. Copper corrosion is weak.
9. Although it is a little expensive than other solders, it is still popularly used because of its superior performance.
Types
(1) Sn-Ag Solder
This tin silver lead free alloy solder includes Sn97Ag3 solder, Sn96.3Ag3.7 solder and Sn96.5Ag3.5 solder.
(2) Sn-Ag-Cu Solder
This tin silver copper lead-free alloy solder includes Sn95.5Ag4Cu0.5 solder, Sn95.8Ag3.5Cu0.7 solder and Sn95.5Ag3.8Cu0.7 solder.
Notes
Different lead free alloy solders feature various solidus and liquidus.