Sn95.8Ag3.5Cu0.7 Solder

Features

1. Like other medium high temp Sn-Ag-Cu solders, Sn_95.8Ag_3.5Cu_0.7 alloy wires/bars are featured with superior thermal fatigue resistance, good wettabililty and excellent soldering performance.

2. During soldering, little smoke and smell arises.

3. Solder joints hardly crack after soldering.

4. Copper corrosion is slow.

5. This medium high temp Sn-Ag-Cu solder possesses strong anti-oxidization, which greatly prevent the tin residue from coming into being.

6. Solder flux is well and uniformly distributed.

Working Principle

Medium high temp Sn-Ag-Cu solders, including Sn_95.8Ag_3.5Cu_0.7 alloy wires/bars, are applicable for soldering, neither brazing nor welding. Soldering is distinguished from brazing by use of a lower melting-temperature filler metal; it is distinguished from welding by the base metals not being melted during the joining process. In a soldering process, heat is applied to the parts to be joined, causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action. After the metal cools, the resulting joints are not as strong as the base metal, but have adequate strength, electrical conductivity and water-tightness for many uses.

Parameters of Medium High Temp Sn-Ag-Cu Solder (Sn_95.8Ag_3.5Cu_0.7)