Tin lead Soldering Flux
Introduction
Lantytk tin-lead soldering flux, also called soft solder is configured based on the features of and exclusively used for the welding of tin-lead solders. Usually, this product appears colorless or orange (LC-102) and liquid. It suits itself for soldering dual and multi-line circuit board and electronics, computers, telecommunication, household appliances, and more.
Advantages
1. The tin-lead soldering flux has little smell, not contaminating the working environment.
2. With this soft solder, there is less residues left on the work piece, contributing to the clean-free property.
3. It has other advantages like favorable wettability, preferable fluidity, high impedance, etc.
4. Besides, Lantytk tin-lead soldering flux passes silver chromate test, copper mirror test, electro-migration and copper plate corrosion test, thus very reliable and effective.
Parameters of LC-100 Tin-Lead Soldering Flux
|
Code
Item |
LC-100 |
LC-101 |
LC-102 |
|
Appearance |
Colorless Liquid |
Colorless Liquid |
Colorless or Orange Liquid |
|
Solids Content (%)
|
2.0 ± 0.2 |
1.5 ± 0.2 |
3 ± 0.5 |
|
Specific Gravity (25℃)
|
0.794 ± 0.01 |
0.794 ± 0.01 |
0.797 ± 0.01 |
|
Acid Value (KOH/g) |
20 ± 0.3 |
21 ± 0.3 |
30 ± 0.4 |
|
Halogen Content (%) |
< 0.01 |
< 0.01 |
------- |
|
Silver Chromate Test |
Pass |
Pass |
Pass |
|
Copper Mirror Test |
Pass |
Pass |
Pass |
|
Copper Plate Corrosion Test |
Pass |
Pass |
Pass |
|
Surface Insulation Resistance (SIR) |
>1 × 1010 |
>1 × 1010 |
>1 × 1010 |
|
Electro-migration |
Pass |
Pass |
Pass |
Notion: 1. SIR test condition: 40℃, 95%RH, 96h; 2. Electro-migration test condition: 65℃, 85%RH.
- Thinner Colorless liquid disposable environmental flux. Low solids content suitable for wave soldering spray, foaming wave soldering, hand dipped and other technology. For a PCB with SMD have excellent lubricating effect and can effectively reduce the phenomenon of SMD solder connection.
- Cleaning Solvent for Soldering Particularly important with thin solve the problem of the gap, caused by the high density assembly of components and components difficult to clean between the cleaning agent is compatible with the problems. Therefore, no-clean flux is generated based on the need for environmental protection and the development of the electronics