BGA Solder Ball
Introduction
The BGA (ball grid array package) solder ball, or lead-free solder ball is used to replace the pin in IC component package structure, meeting the demand of electrical interconnection and mechanical connection. Generally, the ball diameter varies from 0.1 mm to 1.8 mm. Due to different alloy composition, the eutectic temperature is different. The highest temperature is 217 ℃ while the lowest is 183℃. The solder balls are usually applied to digital cameras, MP3/4, laptops, mobile phones, LED, home theatre, etc.
Features
1. Lantytk BGA solder ball is characterized by high reliability, favorable mechanical performance, preferable fatigue resistance and admirable anti-oxidation.
2. Both the purity and the roundness are quite high and have no defects.
3. The minimum ball diameter is 0.10mm. And Lantytk can customize balls of non-standard diameters based on client’s requirement.
4. This BGA solder ball also possesses autocorrection function and allows relatively large tolerance.
5. The lead-free solder ball meets the standard of ROHS and REACH, suitable for advance packing technology and fine welding.
Parameters of BGA Solder Ball
|
Composition of Alloy |
Eutectic Temperature (℃) |
Ball Diameter ( mm) |
Application |
|
Sn63/Pb37 |
183 |
0.1-1.8 |
Digital Camera, MP3/4, Laptop, Mobile communication device (mobile phone, high frequency communication device), LED, LCD, DVD, Computer Main board, Car LCD TV, home theatre, GPS. |
|
Sn100 |
232 |
0.1-1.8 |
|
|
Sn96.5/Ag3.5 |
221 |
0.1-1.8 |
|
|
Sn96.5/Ag3/Cu0.5 |
217 |
0.1-1.8 |
|
|
Sn95.5/Ag4/Cu0.5 |
217 |
0.1-1.8 |
Solder Ball Size and Packaging
|
Ball Diameter (mm) |
Tolerance (mm) |
Roundness (mm) |
Packing Specification (ten thousand/bottle) |
|
0.10 |
± 0.010 |
< 0.008 |
50/100 |
|
0.20 |
± 0.010 |
< 0.008 |
50/100 |
|
0.25 |
± 0.010 |
< 0.008 |
50/100 |
|
0.30 |
± 0.010 |
< 0.010 |
25/50/100 |
|
0.35 |
± 0.010 |
< 0.010 |
25/50/100 |
|
0.40 |
± 0.015 |
< 0.013 |
25/50 |
|
0.45 |
± 0.015 |
< 0.013 |
25/50 |
|
0.50 |
± 0.015 |
< 0.013 |
25 |
|
0.55 |
± 0.015 |
< 0.015 |
25 |
|
0.60 |
± 0.020 |
< 0.018 |
25 |
|
0.65 |
± 0.020 |
< 0.018 |
25 |
|
0.76 |
± 0.020 |
< 0.020 |
25 |
|
1.50 |
± 0.050 |
< 0.040 |
0.5kg |
Use
1. Take out the needed number of BGA solder balls.
2. Put the used lead-free solder ball into a container.
3. Before reusing the balls, make sure again they can work reliably.
4. Do not shake or vibrate the balls vigorously during use.
5. When placing the balls, the soldering flux and solder paste should not be too much or too little.
Storage
1. BGA solder ball should be stored under conditions that the temperature is 25 ±10℃ and the relative humidity is below 60% RH. And it can be stored for as long as twelve months.
2. It had better be working under the same environment as that of the storage.
3. The storage spot is expected to prevent the balls from shake, moisture and direct sunlight. Otherwise, the balls quality will decrease.
4. It is suggested to store the temporarily unused balls in the original bottle and tighten the internal and external covers. Try not to open the bottle when balls are not needed, avoiding solder ball oxidation.
- Solder Iron Tip Tinner At present, there is no better way to prevent solder tip from oxidation except make a prompt replacement. But that is not economical and somehow wastes resources. After years of research and investigation, Lantytk launches solder tip tinner or cleaner which is good at renewing the oxidized tip. The oxidized tip should be putted into the tinner and then be rolled with solder wires.
- Soldering Wire Tube This corrosion resistance tin wire also enjoys fast smelting speed and good fluidity. Lantytk soldering wire tube features little smoke, little pungent odor, few residues and high insulation resistance.The wire can prevent welding joint from cracking and flux from splattering.