Sn Ag Solder

Introduction

Medium-high Sn-Ag solder is fusible metal alloy with a melting range from90 °Cto450°C. Soldering is the process in which two or more metal items are jointed together by melting and leading a filler metal into the joint. Tin silver lead free alloy is widely for connection or repairing electronic equipments in computers, radios, instruments, meters, house appliances, etc.

Features

1. Medium-high Sn-Ag solder is in higher price than some other solders, but it is still popular among customers because it is featured with favorable wettability and good thermal fatigue resistance.

2. It features good fluidity, high soldering speed, little solder splatter, little smoke and smell, weak copper corrosion, etc.

3. Because of strong anti-oxidization, the medium-high Sn-Ag solder produces little residue.

4. Solder flux is well and uniformly distributed.

5. Solder joints rarely crack.

Working Principle

Soldering is distinguished from brazing by use of a lower melting-temperature filler metal; it is distinguished from welding by the base metals not being melted during the joining process. In a soldering process, heat is applied to the parts to be joined, causing the solder to melt and be drawn into the joint by capillary action and to bond to the materials to be joined by wetting action. After the metal cools, the resulting joints are not as strong as the base metal, but have adequate strength, electrical conductivity, and water-tightness for many uses.

Types of Medium-High Sn-Ag Solders

Sn97Ag3 Solder (Bar, Wire)
Sn96.3Ag3.7 Solder (Bar, Wire)
Sn96.5Ag3.5 Solder (Bar, Wire)

Parameters of Medium-High Sn-Ag Solders

Alloy Composition	Melting Point (℃)		Proportion	Application
Alloy Composition	Solidus	Liquidus	Proportion	Application
Sn-3Ag	221	222	7.40	Hand Soldering/Wave Soldering
Sn-3.7Ag	221	221	7.40
Sn-3.5Ag	221	221	7.40

Solder Flux for Medium-High Sn-Ag Solder

Code Item	LC--T-1	LC--H-1	LC--P-1	LC--HF01	LC--WS01
Flux Content (%)	2.2 ± 1.0	2.5 ± 0.5	2.2 ± 1.0	3.0 ± 0.5	2.5 ± 0.5
Halide Content (%)	0.05--0.1	<0.05	<0.05	0	0.1--0.2
Fluorine Content (%)	NONE	NONE	NONE	NONE	NONE
Silver Chromate Test	PASS	PASS	PASS	PASS	PASS
Copper Mirror Test	PASS	PASS	PASS	PASS	PASS
Copper Plate Corrosion Test	PASS	PASS	PASS	PASS	PASS
SIR	>1 ×10¹¹	>1 × 10¹⁰	>1 × 10¹¹	>1 × 10¹¹	>1 ×10¹¹ (After Cleaning)
Electro Migration	PASS	PASS	PASS	PASS	PASS (After Cleaning)
Characteristic	It belongs to halogen-free solder and enjoys wide range of applications.	It is used in soldering nickeling elements and lamp holders.	It is used to solder zinc electrode for capacitors.	It contains little halogen.	Its residue is washable.