Sn96.5Ag3.5 Solder
Introduction
Our Pb free tin silver alloy solder bars and wires are widely used in soldering electronic elements in computers, radios, TV sets, home appliances, instruments, etc. Sn96.5Ag3.5 solder is wildely utilized in these applications, too. Solidus and liquidus of this solder is221 ℃.
Features
1. This kind of Pb free tin silver alloy solder bars and wires are featured by high-purity, strong anti-oxidization, good wettability, fast soldering speed, etc.
2. It is produced according to practical demands. Factors such as melting point, plastic range, melting speed, bondability to different metals, etc. are taken into consideration before production of solders.
3. Like many other Pb free tin silver alloy solder bars and wires, Sn96.5Ag3.5 solder shows adequate joint strength and thermal fatigue resistance.
Parameters
|
Alloy Composition |
Melting Point (℃) |
Specific Gravity |
Application |
|
|
Solidus |
Liquidus |
|||
|
Sn-3.5Ag |
221 |
221 |
7.40 |
|
- Sn96.3Ag3.7 Solder Solder widely properties, high tensile strength, excellent fatigue resistance, special heat conductivity, corrosion resistance strong, powerful antioxidant. Solidus and liquidus is221 ℃. High strength, good oxidation resistance, excellent resistance to thermal fatigue and creep resistance, low melting point, good fluidity characteristics, making it the best solder optoelectronic package.
- Sn Ag Cu Solder The biggest advantage is its copper solder easily reduced oxides of copper, nickel and other metals have good wettability, in vacuum or protective atmosphere brazing carbon steel, low alloy steel, stainless steel, nickel, copper-nickel alloy , tungsten and molybdenum. In a reducing atmosphere brazing, the brazing material should