Sn95Cu4Ag1 Solder
Introduction
Unlike other Sn-Cu-Ag Pb free alloy solders, the Sn95Cu4Ag1 solder wire/bar is specially utilized in precise soldering work for computer chips, mobile phone chips, stainless steel products, LED, PCBs, and so on. Meanwhile, it is suitable for restoration of mini-sized electronic equipments.
Features
1. Active rosin flux in this Sn-Cu-Ag Pb free alloy solder ranges from 1.5% to 2.5%.
2. Wire diameter is0.8 mm. Each reel of solder wire is0.5 kg.
3. It is specially used in PCB and SMD repairing work.
4. Sn95Cu4Ag1 solder wire/bar features good solder ability, strong fatigue resistance and anti-oxidization. .
5. Soldering joint by this Sn-Cu-Ag Pb free alloy solder can produce high resistivity.
6. The three kinds of metal elements are combined in this alloy such as to endows the solder with a high melting point.
7. Solder joints are bright and glossy.
Physical Properties of Sn-Cu-Ag Pb Free Alloy Solders (Sn95Cu4Ag1)
|
Alloy Component |
Melting Point (℃) |
Tensile Strength (g/cm3) |
Rigidity (HB) |
Heat Conductivity (M.S.K) |
Tensile Strength (MPa) |
Elongation Rate (%) |
Electric Conductivity, (%) |
|
Sn95Cu4Ag1 |
230 |
7.4 |
9 |
64 |
32 |
48 |
16.0 |
- Sn92Cu6Ag2 Solder Bar Tin is used to solder electrode welding rod. At elevated temperature and pressure conditions are not required to be used to seal solder metal welding. , Has good antioxidant capacity, high mobility, strong welding, scum rarely melts, and wave soldering immersion little oxidation, the provincial economy tin solder. Excellent wettability and solderability, solder full, uniform, welding with excellent results.
- Sn Ag Solder Sn-Ag lead free solder is featured with high melting point and strong thermal strength. As professional tin silver alloy solder maker, we provide various Sn-Ag solders.The Sn/Ag series solders are widely used in soldering electronic assemblies; besides, it is applicable for soldering of jewelry due to its solder point is of high brightness.