Sn Ag Cu Solder
Introduction
Sn-Ag-Cu solder belongs to lead-free products. Unlike the traditional lead solder, it is environmentally friendly and brings much less harm to human beings. Although Tin-silver-copper alloy solders are in more expensive than Sn-Cu solders, they are still widely applied in lead-free automatic wave soldering and other soldering processes because of good wettability and thermal resistance.
Advantages
1. Sn-Ag-Cu solder fulfills demands of RoHS (Restriction of the Use of Certain Hazardous Substances) and REACH (REGULATION Concerning the Registration, Evaluation,Authorization and Restriction of Chemicals).
2. Superior solder flux helps to increase soldering speed and fluidity.
3. Flux is uniformly distributed.
4. Only a little smoke and smells are released.
5. Cracks rarely arise at soldering points. Besides, surface of the Sn-Ag-Cu solder is protected from copper corrosion.
6. Tin-silver-copper alloy solders feature high insulation resistance. With little slag, it is free from cleaning.
Typical Sn-Ag-Cu Solders
92Sn-6Cu -2Ag
95Sn-4Cu -1Ag
99.3Sn-0.7Cu -0.3Ag
Constitutions of Sn-Ag-Cu Solders
|
Alloy Constitutions |
Melting Point℃ |
Specific Gravity |
Applications |
|
|
Solidus |
Liquidus |
|||
|
92Sn-6Cu -2Ag |
217 |
373 |
7.50 |
Hand/Automatic Soldering |
|
95Sn-4Cu -1Ag |
217 |
335 |
7.40 |
|
|
99.3Sn-0.7Cu -0.3Ag |
217 |
226 |
7.30 |
|
Flux for Sn-Ag-Cu Solders
|
Code Item |
Lc--T-1 |
Lc--H-1 |
Lc--P-1 |
Lc--Hf01 |
Lc--Ws01 |
|
Fluex Content (%) |
2.2±1.0 |
2.5 ± 0.5 |
2.2 ± 1.0 |
3.0 ± 0.5 |
2.5 ± 0.5 |
|
Halide Content (%) |
0.05--0.1 |
<0.05 |
<0.05 |
0 |
0.1--0.2 |
|
Fluorine Content (%) |
None |
None |
None |
None |
None |
|
Silver Chromate Test |
Pass |
Pass |
Pass |
Pass |
Pass |
|
Copper Mirror Test |
Pass |
Pass |
Pass |
Pass |
Pass |
|
Copper Plate Corrosion Test |
Pass |
Pass |
Pass |
Pass |
Pass |
|
Sir |
>1 × 1011 |
>1 × 1010 |
>1×1011 |
>1 × 1011 |
>1 × 1011 (After Cleaning) |
|
Electro Migration |
Pass |
Pass |
Pass |
Pass |
PASS (After Cleaning) |
|
Characteristic |
It belongs to halogen-free solder and enjoys wide range of applications. |
It is used in soldering nickeling elements and lamp holders. |
It is used to solder zinc electrode for capacitors. |
It contains little halogen. |
Its residue is washable. |
SIR Test Condition:40℃, 95% RH, 96h
Electro Migration Test Condition:65℃, 85%RH
Diameter of Sn-Ag-Cu Solder Wire:0.3 mmto12.0 mm
- Sn99Ag0.3Cu0.7 Solder This tin silver copper alloy solder wire/bar/rod (Sn99Ag0.3Cu0.7) is also known as SAC0307 lead-free solder. It is applicable for precise LED, mobile phone chips, PCBs, etc. in many hi-tech wave soldering machines and small-sized tin furnaces.
- Sn95Cu4Ag1 Solder The main requirements for the connection, but the strength of the small joints, such as electronic equipment, instruments, household appliances electronic circuits, computer chips, cell phone chips, stainless steel, lead, PCBs and other joints.