Sn96Ag2.5Bi1Cu0.5 Solder
Introduction
This Sn-Ag-Bi-Cu solder alloy (Sn96Ag2.5Bi1Cu0.5) bar is a rosin-cored and lead-free product. It is applicable for soldering high-precision electronic products and heat-sensitive components, including LEDs, radios, instruments, meters, thermal overload protectors, etc.
Features
1. The (Sn96Ag2.5Bi1Cu0.5) Sn-Ag-Bi-Cu solder alloy bar features low melting point which is about 213 degrees Celsius.
2. With no-clean activated rosin flux inside, the tin silver bismuth copper alloy solder bars/wires show superior soldering performance.
3. Sn-Ag-Bi-Cu solder alloy bar presents high melting speed, favorable wetting property, distinguished electrical conductivity and extraordinary fluidity.
Element Composition
|
Element |
Sn |
Bi |
Pb |
Al |
Sb |
As |
Cu |
Fe |
Zn |
Cd |
Ag |
Ni |
In |
|
Proportion / % |
The Rest |
0.8-1.2 |
0.10 |
0.001 |
0.10 |
0.03 |
0.3-0.7 |
0.02 |
0.001 |
0.002 |
2.3-2.7 |
0.01 |
0.10 |
Physical Parameters of Sn-Ag-Bi-Cu Solder Alloy Bars (Sn96Ag2.5Bi1Cu0.5)
|
Alloy Composition |
Melting Point (℃) |
Specific Gravity |
Application |
|
|
Solidus |
Liquidus |
|||
|
Sn-2.5Ag-1Bi-0.5Cu |
213 |
218 |
7.40 |
Hand Soldering and Wave Soldering |
- Sn In Ag Bi Alloy Solder Different types of solder is different additives, additives to improve the solder in the soldering part of the auxiliary heat conduction process, removal of the oxide, reduces the surface tension of the material to be welded, the welding material of surface oil is removed, increase the welding area. Tin solder alloy wire charact