Bi58Sn42 Sn Bi Solder Wire
Description
Our Sn42Bi58 solder wire is a rosin-cored and lead-free product. With low temperature and melting point, Sn-Bi solder wire can be applied in high-precision LED products. It is also adaptable to the soldering of heat-sensitive components of electronic products, as well as the soldering of both thermal overload protector and safety components.
Features
1. Its melting point is approximately138℃
2. The flux content is 2.0%.
3. Our company is able to produce no-clean and solid core solder wire.
4.The minimum diameter of our Sn Bisolder wire reaches0.5mm.
Parameters of Bi58Sn42 Low Temperature Solder
|
Alloy Composition |
Melting Point(℃) |
Specific Gravity |
Recommended Applications |
|
|
Solidus |
Liquidus |
|||
|
Sn-58Bi |
139 |
139 |
8.70 |
Manual Dip Soldering and Wave Soldering |
Ingredients of Low Temperature Sn-Bi Solder Wire
|
Element |
Sn |
Bi |
Pb |
Al |
Sb |
As |
Cu |
Fe |
Zn |
Cd |
Ag |
Ni |
In |
|
Content/% |
41.0-43.0 |
Remain |
0.05 |
0.005 |
0.05 |
0.03 |
0.08 |
0.01 |
0.003 |
0.002 |
0.05 |
0.01 |
0.05 |
Actually, this product is more difficult to be manufactured than other solder wires. But its consumption rate is over 5 times as high as that of the common solder wires. Only a few manufacturers are capable of supplying this Sn-Bi solder wire in current soldering industry. Our product has been sold toUnited States,South Korea, andChile, among other countries. Beyond that, we are looking for more agents on a global scale. Please don’t hesitate to contact us, if you show interest in our products.
- In52Sn48 Sn In Solder(Tin Indium Alloy Solder) Using a vacuum induction furnace. Good brazing process for transition joints for brazing copper and aluminum, stable mechanical properties of brazed joints, good electrical properties, used in electronics, electrical appliances, such as televisions, radios, radio transponders, instruments and calculators, etc.
- Bi58Sn42 Sn Bi Solder(Tin Bismuth Alloy Solder) When using solder as arc welding, the temperature often exceeds the base metal and solder itself many, no hard and soft points; while solder hard solder, such as copper and zinc materials (copper-zinc alloy), silver solder (silver-copper alloy ) of the solder joint strength was largely higher connection strength requirements for